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    Glass Wafer

    Glass Wafer

     FOCtek Glass Wafer:

    * High Volume Double Side Polishing Capacity
     
    * Large Coating Machine up to 1.8m Chamfer
     
    * High Cost Efficiency for volume production
     

    Glass Wafer can be used for:

    * 3D imaging and sensing
     
    * Wafer-level package
     
    * Encapsulated glass carrier wafer
     
    * MEMS
     
    * Microdisplay
     
    * Microfluidic technology

        Specification parameter

    Product

    		 FusedWindow/Wafer
    Material Fused Silica/Optical Glass/ Silicon
    Dimension(mm) 100mm/150mm/200mm/300mm
    Thickness (mm) 0.2mm（100/150mm），0.3mm（200/300mm）
    Tolerance (mm) +/- 0.02mm (Commercial),  +/- 0.002mm(Precision)
    Surface Quality 40-20 (Commercial), 10-5 (Precision)

    Surface Figure or Transmitted Wavefront

    		 ≤ 0.1 waves PV (per 25.4mm @ 632.8nm）

     

     

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